LPM-50A Diode laser marking machine

Feature Description:
Use the most advanced laser technology, semiconductor packaging array of imports, with 808nm wavelength semiconductor laser diode-pumped Nd: YAG media, instead of the traditional lamp-pumped laser is the best choice, sealed optical system using the whole structure, a graphic preview function and focus instructions appearance more attractive, more convenient operation; The machine equipped the latest external water cooling system, temperature control to + / -1 degrees , very low noise, provides a reliable protection for a long time operation. Overall integration structure, marking high efficiency, metal / nonmetal marking good effect.
Relevant Parameters:
Laser Power:≤50W
Laser wave length:1064mm
Frequency:≤50KHz
Laser repeated frequency:≤50KHz
Size:110mm*110mm
Min-laser beam:0.03mm
Smallest Character Engraving:0.15mm
Max Marking Moving Speed:10000mm/s
Mark Engraves depth:≤0.3mm
Light Quality:≤10
Repeat positioning accuracy:±0.01mm
Unit Power:6KW
Electricity demand:220V/One Phase/50HZ/30A
Cooling requirements:10℃~30℃ Pure Water
Supported graphics formats:PLT、BMP、DXF

Application of industry:
Can marking metals and a variety of non-metallic materials. Even in some of the requirements for more sophisticated, higher accuracy occasions. For electronic components, integrated circuits (IC), electrical appliances, mobile communications, hardware products, tools, accessories, precision instruments, watches, glasses, jewelry accessories, auto parts, plastic buttons, building materials, PVC pipes and medical equipment industries. Application materials include: ordinary metals and alloys (iron, copper, aluminum, magnesium, and zinc all metal), rare metals and alloys (gold, silver, titanium), metal oxides (various metal oxides can be), a special surface treatment (phosphating, anodized aluminum, the surface Electroplating ), ABS material (coat electrical appliances, daily necessities), Ink (translucent keys, printing products), epoxy resin (electronic components packaging, insulation layer).

Applicable Materials: